Invention Grant
- Patent Title: Blind via printed circuit board fabrication supporting press fit connectors
- Patent Title (中): 通过印刷电路板制造支撑压配合连接器
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Application No.: US13628532Application Date: 2012-09-27
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Publication No.: US09179546B2Publication Date: 2015-11-03
- Inventor: Kevin W. Mundt , Jason D. Adrian
- Applicant: Dell Products L.P.
- Applicant Address: US TX Roud Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Roud Rock
- Agency: Terrile, Cannatti, Chambers & Holland, LLP
- Agent Robert W. Holland
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K1/11 ; H05K3/00 ; H05K3/42 ; H05K3/30 ; H05K3/46 ; H01R12/58
Abstract:
An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.
Public/Granted literature
- US20140083754A1 BLIND VIA PRINTED CIRCUIT BOARD FABRICATION SUPPORTING PRESS FIT CONNECTORS Public/Granted day:2014-03-27
Information query
