Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US13771636Application Date: 2013-02-20
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Publication No.: US09183879B2Publication Date: 2015-11-10
- Inventor: Yoshito Fujimura , Tetsuya Ohsawa , Jun Ishii
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2012-033893 20120220; JP2012-275135 20121217
- Main IPC: G11B21/16
- IPC: G11B21/16 ; G11B5/48

Abstract:
A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion.
Public/Granted literature
- US20130215726A1 SUSPENSION BOARD WITH CIRCUIT Public/Granted day:2013-08-22
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