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公开(公告)号：US09502058B2
公开(公告)日：2016-11-22
申请号：US14878319
申请日：2015-10-08
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito Fujimura , Hiroyuki Tanabe , Saori Kanezaki , Naohiro Terada , Yuu Sugimoto
IPC: G11B5/48
CPC classification number: G11B5/4853 , G11B5/4826 , G11B5/484
Abstract: A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.
Abstract translation: 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。
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公开(公告)号：US09183879B2
公开(公告)日：2015-11-10
申请号：US13771636
申请日：2013-02-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito Fujimura , Tetsuya Ohsawa , Jun Ishii
CPC classification number: G11B21/16 , G11B5/4826 , G11B5/4833 , G11B5/4853
Abstract: A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion.
Abstract translation: 一种悬挂板，具有用于安装包括电子器件的滑块单元的电路，当相对于设置有磁头的滑块在厚度方向上突出时，安装电子装置形成与滑块重叠的重叠部分 ，以及从滑块突出的突出部。 具有电路的悬挂板形成有沿厚度方向贯穿的第一开口并容纳重叠部分，以及与第一开口连通并容纳突出部分的第二开口。
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公开(公告)号：US10524363B2
公开(公告)日：2019-12-31
申请号：US15628059
申请日：2017-06-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: A method includes the following steps: S1, providing the insulating layer having an inclined face; S4, disposing a photomask so that in the photoresist, first and second exposure portions are exposed to light, and exposing the photoresist is to light through the photomask; S5, removing the first and the second exposure portions of the photoresist. On the assumption that in S4, light reflected at the metal thin film is focused between the first and the second exposure portions of the photoresist, the inclined face has a bending portion bending in one direction, the portion removed in S5 in the photoresist due to light focus being continuous with the first and the second exposure portions. The second exposure portion includes continuously an avoidance portion that avoids the bending portion and an overlapping portion that overlaps with at least a portion other than the bending portion in the inclined face.
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公开(公告)号：US09338888B2
公开(公告)日：2016-05-10
申请号：US13826096
申请日：2013-03-14
Applicant: NITTO DENKO CORPORATION
Inventor： Saori Kanezaki , Hitoki Kanagawa , Yoshito Fujimura
CPC classification number: H05K1/18 , G11B5/484 , G11B5/486 , G11B5/4873 , G11B5/5552 , H05K1/056 , H05K1/111 , H05K3/321 , H05K2201/10083 , Y02P70/611
Abstract: A wired circuit board includes a wire and a terminal formed continuously to the wire and electrically connected to an electronic element at one surface thereof in a thickness direction. The terminal includes a first contact portion, and a second contact portion provided around the first contact portion to protrude more than the first contact portion toward one side in the thickness direction.
Abstract translation: 布线电路板包括线和连续地连接到线并且在厚度方向的一个表面处电连接到电子元件的端子。 端子包括第一接触部分和第二接触部分，该第二接触部分设置在第一接触部分的周围，以使其比第一接触部分沿厚度方向朝向一侧突出。
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公开(公告)号：US08797831B2
公开(公告)日：2014-08-05
申请号：US14087465
申请日：2013-11-22
Applicant: Nitto Denko Corporation
Inventor： Yoshito Fujimura , Jun Ishii , Terukazu Ihara
IPC: G11B11/00
CPC classification number: G11B5/4826 , G11B5/486 , G11B5/6088 , G11B2005/0021
Abstract: A suspension board with circuit is for mounting thereon a slider/light source unit provided with a slider on which a magnetic head is mounted, and a light source device including a main body, and a light source provided to protrude from the main body. The suspension board with circuit includes a receiving portion formed therein to be capable of receiving the light source, and a guide surface for guiding the light source to the receiving portion when the slider/light source unit is mounted.
Abstract translation: 具有电路的悬挂板用于在其上安装设置有安装有磁头的滑块的滑块/光源单元，以及包括主体和设置成从主体突出的光源的光源装置。 具有电路的悬挂板包括形成在其中以能够接收光源的接收部分和用于当安装滑块/光源单元时将光源引导到接收部分的引导表面。
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Patent Agency Ranking
公开(公告)号：US10558121B2
公开(公告)日：2020-02-11
申请号：US15605259
申请日：2017-05-25
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.
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公开(公告)号：US10257926B2
公开(公告)日：2019-04-09
申请号：US15463538
申请日：2017-03-20
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Yoshito Fujimura , Hiroyuki Tanabe
Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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公开(公告)号：US10210890B2
公开(公告)日：2019-02-19
申请号：US15058509
申请日：2016-03-02
Applicant: NITTO DENKO CORPORATION
Inventor： Yoshito Fujimura
Abstract: A method for producing a wired circuit board includes a first step of preparing a metal supporting layer; a second step of forming an insulating layer having a first opening and terminal forming portions on the metal supporting layer; a third step of forming a conductor layer having terminal portions and an electrically conductive portion on the insulating layer; a fourth step of, by partially removing the metal supporting layer, forming a metal supporting frame portion, a metal supporting connecting portion, and a reinforcement metal supporting portion; and a fifth step of forming a metal plating layer at surfaces of the terminal portions by electrolytic plating via the metal supporting connecting portion.
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公开(公告)号：US09894774B2
公开(公告)日：2018-02-13
申请号：US15087068
申请日：2016-03-31
Applicant: Nitto Denko Corporation
Inventor： Yoshito Fujimura , Jun Ishii
CPC classification number: H05K3/06 , G11B5/484 , G11B5/4853 , H01R9/091 , H05K1/056 , H05K1/11 , H05K1/111 , H05K3/061 , H05K3/107 , Y02P70/611
Abstract: A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 μm.
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公开(公告)号：US09572259B2
公开(公告)日：2017-02-14
申请号：US14755173
申请日：2015-06-30
Applicant: NITTO DENKO CORPORATION
Inventor： Naohiro Terada , Yoshito Fujimura
CPC classification number: H05K1/181 , H05K1/0281 , H05K1/189 , H05K2201/0394 , H05K2201/2009 , Y02P70/611
Abstract: A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of the metal supporting board and having an insulating opening portion passing through the thickness direction, when projected in the thickness direction, to be included in the support opening portion; and a conductive layer having a wire portion disposed on an upper surface of the base insulating layer and a terminal portion disposed in the insulating opening portion to be connected to an electronic element and connected to the wire portion. The base insulating layer has a cutout portion obtained by cutting out the base insulating layer in a direction orthogonal to the thickness direction and continuous to the insulating opening portion and the terminal portion includes a terminal free end portion opened by the cutout portion.
Abstract translation: 具有电路的悬挂板包括具有穿过厚度方向的支撑开口部分的金属支撑板; 基底绝缘层，其设置在所述金属支撑基板的上表面上，具有贯穿所述厚度方向的绝缘开口部，当在厚度方向上突出时，所述绝缘开口部包含在所述支撑开口部中; 以及导电层，其具有布置在所述基底绝缘层的上表面上的导线部分和设置在所述绝缘开口部分中以连接到电子元件并连接到所述导线部分的端子部分。 所述基底绝缘层具有通过在与所述厚度方向正交的方向上切割所述基底绝缘层而与所述绝缘开口部连续的端部而形成的切口部，并且所述端子部包括由所述切口部开口的端子自由端部。
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