Invention Grant
- Patent Title: LED structure
- Patent Title (中): LED结构
-
Application No.: US14451508Application Date: 2014-08-05
-
Publication No.: US09184334B2Publication Date: 2015-11-10
- Inventor: Shouli Steve Hsia , Chih-Kuang Yu , Ken Wen-Chien Fu , Hung-Yi Kuo , Hung-Chao Kao , Ming-Feng Wu , Fu-Chih Yang
- Applicant: TSMC Solid State Lighting Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/15 ; H01L33/62
Abstract:
A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer.
Public/Granted literature
- US20140339579A1 LED Structure Public/Granted day:2014-11-20
Information query
IPC分类:
