A socket housing and method of making the socket housing. A plurality of dielectric layers are printed with a plurality of recesses on a substrate. The dielectric layers include at least two different dielectric materials. A sacrificial material is printed in the recesses. The assembly is removed from the substrate and the sacrificial material is removed from the recesses. At least one contact member is located in a plurality of the recesses. Distal ends of the contact members are adapted to electrically couple with circuit members.