Invention Grant
- Patent Title: Apparatus and method for probe shape processing by ion beam
- Patent Title (中): 离子束探针形状处理装置及方法
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Application No.: US13641211Application Date: 2011-04-12
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Publication No.: US09202672B2Publication Date: 2015-12-01
- Inventor: Shinya Kitayama , Satoshi Tomimatsu , Tsuyoshi Onishi
- Applicant: Shinya Kitayama , Satoshi Tomimatsu , Tsuyoshi Onishi
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Baker Botts L.L.P.
- Priority: JP2010-094909 20100416
- International Application: PCT/JP2011/059044 WO 20110412
- International Announcement: WO2011/129315 WO 20111020
- Main IPC: H01J37/31
- IPC: H01J37/31 ; H01J37/305 ; H01J37/304

Abstract:
There is provided an apparatus and a method capable of preparing a standardized probe without need for working skill of probe processing. According to the present invention, a probe shape generation process of detecting a probe shape based on the probe incoming current detected by a probe current detection unit, a probe tip coordinate extraction process of detecting a tip position of the probe from the probe shape, a probe contour line extraction process of generating a probe contour line obtained by approximating a contour of the probe from the tip position of the probe and the probe shape, a probe center line extraction process of generating a center line and a vertical line of the probe from the probe contour line, a processing pattern generation process of generating a processing pattern based on the probe tip position, the probe center line, the probe vertical line, and a preset shape and dimension of a probe acute part, and an ion beam termination process of performing, based on the processing pattern, termination of ion-beam processing are performed.
Public/Granted literature
- US20130032714A1 ION BEAM APPARATUS AND ION-BEAM PROCESSING METHOD Public/Granted day:2013-02-07
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