Invention Grant
- Patent Title: Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing
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Application No.: US11888341Application Date: 2007-07-31
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Publication No.: US09202736B2Publication Date: 2015-12-01
- Inventor: Kadthala Ramaya Narendrnath , Dmitry Lubomirsky , Xinglong Chen , Sudhir Gondhalekar , Muhammad Rasheed , Tony Kaushal
- Applicant: Kadthala Ramaya Narendrnath , Dmitry Lubomirsky , Xinglong Chen , Sudhir Gondhalekar , Muhammad Rasheed , Tony Kaushal
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: B23P6/00
- IPC: B23P6/00 ; H01L21/683 ; H02N13/00
Abstract:
A method for refurbishing at least a portion of an electrostatic chuck. The method comprises removing a first dielectric component from a fluid distribution element of the electrostatic chuck and replacing the first dielectric component with a second dielectric component.
Public/Granted literature
- US20090034149A1 Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing Public/Granted day:2009-02-05
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