Invention Grant
- Patent Title: Thin film semiconductor device and manufacturing method therefor
- Patent Title (中): 薄膜半导体器件及其制造方法
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Application No.: US14480958Application Date: 2014-09-09
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Publication No.: US09202928B2Publication Date: 2015-12-01
- Inventor: Hiroshi Hayashi , Tomoaki Izumi , Mami Nonoguchi , Toshiaki Yoshitani
- Applicant: JOLED INC.
- Applicant Address: JP Tokyo
- Assignee: JOLED INC.
- Current Assignee: JOLED INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2013-205683 20130930
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L29/786 ; H01L21/02

Abstract:
A thin film semiconductor device comprises a substrate, a gate electrode disposed above the substrate, an oxide semiconductor layer disposed above the substrate so as to oppose the gate electrode, a channel protective layer disposed on the oxide semiconductor layer, and a source electrode and a drain electrode each connected to the oxide semiconductor layer. The density of states DOS [eV−1cm−3] of oxygen defects in the oxide semiconductor layer satisfies the following relationship: DOS≦1.710×1017×(Ec−E)2−6.468×1017×(Ec−E)+6.113×1017 provided that 2.0 eV≦Ec−E≦2.7 eV where Ec [eV] is an energy level of a conduction band edge of the oxide semiconductor layer and E [eV] is a predetermined energy level of the oxide semiconductor layer.
Public/Granted literature
- US20150091002A1 THIN FILM SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2015-04-02
Information query
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