Invention Grant
- Patent Title: Electronic device packages having bumps and methods of manufacturing the same
- Patent Title (中): 具有凸块的电子器件封装及其制造方法
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Application No.: US14532393Application Date: 2014-11-04
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Publication No.: US09209146B2Publication Date: 2015-12-08
- Inventor: Seung Jee Kim , Qwan Ho Chung , Jong Hyun Nam , Si Han Kim , Sang Yong Lee , Seong Cheol Shin
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0063202 20120613
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L23/538 ; H01L21/768 ; H01L23/31 ; H01L21/56
Abstract:
An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.
Public/Granted literature
- US20150056755A1 ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2015-02-26
Information query
IPC分类:
