Invention Grant
- Patent Title: Semiconductor memory device and erasing method
- Patent Title (中): 半导体存储器件和擦除方法
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Application No.: US14272512Application Date: 2014-05-08
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Publication No.: US09214241B2Publication Date: 2015-12-15
- Inventor: Makoto Senoo
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Priority: JP2013-206243 20131001
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C16/14 ; G11C16/16

Abstract:
A reliable semiconductor memory device and an erasing method for erasing data in a reliable manner are provided. The erasing method is applied to erase a semiconductor memory device having a memory array, and the memory array has an NAND string. A predetermined voltage is applied to a gate of a select transistor of the NAND string, and the predetermined voltage is applied to a word line of a memory cell of the NAND string. An erasing voltage is applied to a substrate region at a first timing, and the substrate region has the NAND string. The gate of the select transistor is floated at a second timing. Here, there is a fixed time interval between the first timing and the second timing, and the second timing is later than the first timing.
Public/Granted literature
- US20150092491A1 SEMICONDUCTOR MEMORY DEVICE AND ERASING METHOD Public/Granted day:2015-04-02
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