Invention Grant
US09223362B2 Electronic apparatus and cooling module mounted in that electronic apparatus
有权
安装在该电子设备中的电子设备和冷却模块
- Patent Title: Electronic apparatus and cooling module mounted in that electronic apparatus
- Patent Title (中): 安装在该电子设备中的电子设备和冷却模块
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Application No.: US14028963Application Date: 2013-09-17
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Publication No.: US09223362B2Publication Date: 2015-12-29
- Inventor: Masayuki Watanabe , Kenji Sasabe , Eiji Wajima , Masumi Suzuki , Michimasa Aoki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2012-197918 20120907
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.
Public/Granted literature
- US20140071616A1 ELECTRONIC APPARATUS AND COOLING MODULE MOUNTED IN THAT ELECTRONIC APPARATUS Public/Granted day:2014-03-13
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