- Patent Title: Compound semiconductor device and manufacturing method of the same
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Application No.: US14561450Application Date: 2014-12-05
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Publication No.: US09224848B2Publication Date: 2015-12-29
- Inventor: Toshihide Kikkawa
- Applicant: Transphorm Japan, Inc.
- Applicant Address: JP Yokohama
- Assignee: Transphorm Japan, Inc.
- Current Assignee: Transphorm Japan, Inc.
- Current Assignee Address: JP Yokohama
- Agency: Fish & Richardson P.C.
- Priority: JP2012-077624 20120329
- Main IPC: H01L29/205
- IPC: H01L29/205 ; H01L29/778 ; H01L21/02 ; H02M3/335 ; H01L29/66 ; H01L29/20 ; H01L29/207 ; H01L29/201 ; H02M1/088 ; H01L29/10

Abstract:
An AlGaN/GaN.HEMT includes, a compound semiconductor lamination structure; a p-type semiconductor layer formed on the compound semiconductor lamination structure; and a gate electrode formed on the p-type semiconductor layer, in which Mg being an inert element of p-GaN is introduced into both sides of the gate electrode at the p-type semiconductor layer, and introduced portions of Mg are inactivated.
Public/Granted literature
- US20150078038A1 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2015-03-19
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