A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.