公开(公告)号：US09226410B2

公开(公告)日：2015-12-29

申请号：US14375824

申请日：2013-01-24

Applicant: Trackwise Designs Limited

Inventor： Philip Johnston

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  B32B37/10 ,  H05K3/06

CPC classification number: H05K3/4611 ,  B32B37/1027 ,  B32B2457/08 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/06 ,  H05K3/064 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4635 ,  H05K3/4638 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2203/068 ,  H05K2203/1545 ,  H05K2203/167

Abstract: A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.

Abstract translation: 一种制造多层柔性电路的方法包括提供第一和第二柔性基板，每个柔性基板包括导体层和绝缘体层。 第一基板的导体层是图案化的导体层。 第一和第二基板使用双带压机层压在一起，基板通过该双层压机连续地移动。 该方法可以包括使用蚀刻方法图案化第一衬底的导体层和/或第二衬底的导体层，该蚀刻方法包括通过执行多个相邻和相邻的曝光来将导体层上的干膜抗蚀剂暴露于图案 /或重叠区域。

公开(公告)号：US20150108084A1

公开(公告)日：2015-04-23

申请号：US14375824

申请日：2013-01-24

Applicant: Trackwise Designs Limited

Inventor： Philip Johnston

IPC: H05K3/46 ,  H05K3/06

CPC classification number: H05K3/4611 ,  B32B37/1027 ,  B32B2457/08 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/06 ,  H05K3/064 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4635 ,  H05K3/4638 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2203/068 ,  H05K2203/1545 ,  H05K2203/167

Abstract: A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.

Abstract translation: 一种制造多层柔性电路的方法包括提供第一和第二柔性基板，每个柔性基板包括导体层和绝缘体层。 第一基板的导体层是图案化的导体层。 第一和第二基板使用双带压机层压在一起，基板通过该双层压机连续地移动。 该方法可以包括使用蚀刻方法图案化第一衬底的导体层和/或第二衬底的导体层，该蚀刻方法包括通过执行多个相邻和相邻的曝光来将导体层上的干膜抗蚀剂暴露于图案 /或重叠区域。