A device for forming a microstructured coating on a substrate. The device includes a microstructured band that can be moved by rolling without slipping on the substrate and going around main pressure application elements assembled on a chassis, and secondary pressure application elements assembled on the chassis so as to be in contact with an inner face of the band in a zone of a strand of the band delimited by said main pressure application elements, this zone being exposed to the action of a curing apparatus that accelerates curing of a curable material designed to form said coating. A method for forming a microstructured coating using the above-mentioned device.