Invention Grant
- Patent Title: Method of manufacturing an ejection orifice member
- Patent Title (中): 喷射孔构件的制造方法
-
Application No.: US14453061Application Date: 2014-08-06
-
Publication No.: US09227406B2Publication Date: 2016-01-05
- Inventor: Shinan Wang , Yasuto Kodera , Yasuyuki Tamura
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2013-179129 20130830
- Main IPC: B41J2/16
- IPC: B41J2/16

Abstract:
A method of manufacturing an ejection orifice member includes: preparing a substrate including a first layer, a second layer, and a third layer, the first layer protruding in a first direction crossing a principal surface of the substrate, the second and third layers being formed on the first direction side of the first layer, the preparing a substrate including forming the second layer to follow a contour of a first direction side surface of the first layer, and then forming the third layer on a surface of the second layer which protrudes on the first direction side; performing plating using the second layer as a seed to form a fourth layer on the first direction side of the second layer; removing the third layer from the fourth layer to form a hole as the ejection orifice in the fourth layer; and thinning the fourth layer at least around the hole.
Public/Granted literature
- US20150060397A1 METHOD OF MANUFACTURING AN EJECTION ORIFICE MEMBER Public/Granted day:2015-03-05
Information query
IPC分类: