Invention Grant
US09228945B2 Sensor chip, detection device, and method of manufacturing sensor chip
有权
传感器芯片,检测装置及传感器芯片制造方法
- Patent Title: Sensor chip, detection device, and method of manufacturing sensor chip
- Patent Title (中): 传感器芯片,检测装置及传感器芯片制造方法
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Application No.: US13334861Application Date: 2011-12-22
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Publication No.: US09228945B2Publication Date: 2016-01-05
- Inventor: Yusuke Sakagami
- Applicant: Yusuke Sakagami
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2010-287189 20101224
- Main IPC: G01N21/552
- IPC: G01N21/552 ; G01J3/44 ; G01N21/65 ; H01L27/144

Abstract:
A sensor chip includes a substrate, a relief structure composed of protruding sections formed so as to be arranged on a surface of the substrate to have a lattice shape and a recessed section between the protruding sections, and fine metal particles arranged along upper ridge lines of the respective protruding sections of the relief structure, the protruding sections being adjacent to each other, having a minute gap with which the surface plasmon resonance occurs. By irradiating the gap between the fine metal particles with a laser beam, the localized surface plasmon resonance occurs more efficiently. As a result, the sensor chip capable of taking out the surface enhanced Raman scattering to thereby detect the substance with high sensitivity can be realized.
Public/Granted literature
- US20120162640A1 SENSOR CHIP, DETECTION DEVICE, AND METHOD OF MANUFACTURING SENSOR CHIP Public/Granted day:2012-06-28
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