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US09235662B2 Lithography model for 3D resist profile simulations 有权
3D抗蚀剂轮廓模拟的平版印刷模型

Lithography model for 3D resist profile simulations
Abstract:
Described herein is a method for simulating a three-dimensional spatial intensity distribution of radiation formed within a resist layer on a substrate resulting from an incident radiation, the method comprising: calculating an incoherent sum of forward propagating radiation in the resist layer and backward propagating radiation in the resist layer; calculating an interference of the forward propagating radiation in the resist layer and the backward propagating radiation in the resist layer; and calculating the three-dimensional spatial intensity distribution of radiation from the incoherent sum and the interference.
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