Invention Grant
- Patent Title: Tape film packages and methods of fabricating the same
- Patent Title (中): 胶带包装及其制造方法
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Application No.: US13747832Application Date: 2013-01-23
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Publication No.: US09241407B2Publication Date: 2016-01-19
- Inventor: Jeong-Kyu Ha , Youngshin Kwon , KwanJai Lee , Jae-Min Jung , KyongSoon Cho , Sang-Uk Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2012-0007303 20120125
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H05K1/11 ; H05K3/10 ; H01L23/00 ; H05K3/00 ; H05K1/18 ; H05K3/42
Abstract:
A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.
Public/Granted literature
- US20130186680A1 Tape Film Packages and Methods of Fabricating the Same Public/Granted day:2013-07-25
Information query
IPC分类:
