Invention Grant
US09245815B2 Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
有权
底部填充材料包括嵌段共聚物，以调节热膨胀系数和拉伸模量
- Patent Title: Underfill material including block copolymer to tune coefficient of thermal expansion and tensile modulus
- Patent Title (中): 底部填充材料包括嵌段共聚物，以调节热膨胀系数和拉伸模量
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Application No.: US14265199Application Date: 2014-04-29
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Publication No.: US09245815B2Publication Date: 2016-01-26
- Inventor: Sivakumar Nagarajan
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/48 ; H01L21/00 ; H01L23/29 ; H01L23/31 ; H01L23/00 ; H01L21/56 ; C09J163/00 ; C09J187/00 ; C09J153/00
Abstract:
Embodiments of the present disclosure are directed toward underfill material including block copolymer. In one embodiment, an underfill material includes epoxy material and a copolymer including an epoxy-philic block and an epoxy-phobic block, wherein the epoxy-philic block is miscible in the epoxy material, the epoxy-phobic block is covalently bonded with the epoxy-philic block, the epoxy-phobic block is separated in a microphase domain within the epoxy material and the epoxy-philic block is configured to restrict thermal expansion or contraction of the epoxy material.
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