Invention Grant
- Patent Title: Optical sensing element arrangement with integral package
- Patent Title (中): 具有集成封装的光学传感元件布置
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Application No.: US13661274Application Date: 2012-10-26
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Publication No.: US09250126B2Publication Date: 2016-02-02
- Inventor: Arthur John Barlow
- Applicant: Excelitas Technologies GmbH & Co. KG
- Applicant Address: SG Singapore
- Assignee: Excelitas Technologies Singapore PTE. Ltd
- Current Assignee: Excelitas Technologies Singapore PTE. Ltd
- Current Assignee Address: SG Singapore
- Agency: Sheehan Phinney Bass + Green PA
- Agent Peter A. Nieves
- Main IPC: G01J5/02
- IPC: G01J5/02 ; G01J1/46 ; G01J1/42 ; H05K13/00 ; H05K13/04 ; H05K3/32 ; G01J5/04 ; G01J5/20 ; G01J5/24 ; G01J5/08
Abstract:
A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.
Public/Granted literature
- US20140117201A1 OPTICAL SENSING ELEMENT ARRANGEMENT WITH INTEGRAL PACKAGE Public/Granted day:2014-05-01
Information query
