Invention Grant
- Patent Title: Operation method for vacuum processing apparatus
- Patent Title (中): 真空处理设备的操作方法
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Application No.: US13975612Application Date: 2013-08-26
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Publication No.: US09257318B2Publication Date: 2016-02-09
- Inventor: Michinori Kawaguchi , Satomi Inoue , Yoshiro Suemitsu , Keita Nogi
- Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2013-070938 20130329
- Main IPC: G06F7/00
- IPC: G06F7/00 ; H01L21/677

Abstract:
A method for operating a vacuum processing apparatus, the vacuum processing apparatus including: a plurality of cassette stands on which a cassette capable of housing a plurality of wafers therein can be placed; a plurality of vacuum processing vessels each having a processing chamber arranged therein, wherein the wafer is arranged and processed in the processing chamber; and at least one transport robot transporting the wafer on a transport path between either one of the plurality of cassettes and the plurality of vacuum processing vessels, the vacuum processing apparatus sequentially transporting in a predetermined transport order the plurality of wafers from either one of the plurality of cassettes to a predetermined one of the plurality of vacuum processing vessels and processing the plurality of wafers. The method includes a number determining step, a remaining-time determining step and a transport order skip step.
Public/Granted literature
- US20140294555A1 OPERATION METHOD FOR VACUUM PROCESSING APPARATUS Public/Granted day:2014-10-02
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