Invention Grant
- Patent Title: Microphone system with offset apertures
- Patent Title (中): 具有偏移孔的麦克风系统
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Application No.: US13795026Application Date: 2013-03-12
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Publication No.: US09258634B2Publication Date: 2016-02-09
- Inventor: Jicheng Yang , Thomas M. Goida
- Applicant: Invensense, Inc.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: IPxLaw Group LLP
- Agent Maryam Imam
- Main IPC: H04R9/08
- IPC: H04R9/08 ; H04R1/04 ; B81B7/00 ; H04R1/22 ; H04R19/00

Abstract:
A microphone system has a base forming a base aperture, and a lid coupled to the base to form a package having an interior chamber. The system also has a member coupled with the base within the interior chamber, and a microphone die coupled to the member within the interior chamber. The member is positioned between the base and the microphone die and has a member aperture that is laterally offset from the base aperture. The member aperture, member, and base together form an acoustic path between the base aperture and the microphone die.
Public/Granted literature
- US20130195284A1 Microphone System with Offset Apertures Public/Granted day:2013-08-01
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