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Patent Agency Ranking
公开(公告)号：US09258634B2
公开(公告)日：2016-02-09
申请号：US13795026
申请日：2013-03-12
Applicant: Invensense, Inc.
Inventor： Jicheng Yang , Thomas M. Goida
CPC classification number: H04R1/04 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01L2924/15151 , H01L2924/16152 , H04R1/222 , H04R19/005 , H01L2924/00014 , H01L2924/00012
Abstract: A microphone system has a base forming a base aperture, and a lid coupled to the base to form a package having an interior chamber. The system also has a member coupled with the base within the interior chamber, and a microphone die coupled to the member within the interior chamber. The member is positioned between the base and the microphone die and has a member aperture that is laterally offset from the base aperture. The member aperture, member, and base together form an acoustic path between the base aperture and the microphone die.
Abstract translation: 麦克风系统具有形成基座孔的底座和联接到基座的盖以形成具有内部腔室的包装。 该系统还具有与内部室内的基部连接的构件，以及耦合到内部室内的构件的麦克风模具。 该构件位于基座和麦克风模具之间，并且具有从基座孔侧向偏移的构件孔。 构件孔，构件和底座一起在基座孔和麦克风管芯之间形成声路。
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公开(公告)号：US20140307909A1
公开(公告)日：2014-10-16
申请号：US13863807
申请日：2013-04-16
Applicant: Invensense, Inc.
Inventor： Jicheng Yang , Lee J. Jacobson , Sushil Bharatan , Thomas D. Chen
IPC: H04R1/08
CPC classification number: H04R19/04 , H04R19/005
Abstract: A microphone system has a package with an interior chamber and an inlet aperture for receiving an acoustic signal, and a microphone die having a backplate and a diaphragm. The microphone is positioned within the package interior to form a front volume between the diaphragm and the inlet aperture. Accordingly, the microphone is positioned to form a back volume defined in part by the diaphragm within the interior chamber. The system also has a stop member positioned in the back volume so that the diaphragm is between the stop member and the backplate.
Abstract translation: 麦克风系统具有包括内部腔室和用于接收声学信号的入口孔口，以及具有背板和隔膜的麦克风模具。 麦克风位于包装内部，以形成隔膜和入口孔之间的前部容积。 因此，麦克风被定位成形成由内部室内的隔膜部分限定的后部体积。 系统还具有定位在后部体积中的止动构件，使得隔膜位于止动构件和背板之间。
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公开(公告)号：US09338559B2
公开(公告)日：2016-05-10
申请号：US13863807
申请日：2013-04-16
Applicant: Invensense, Inc.
Inventor： Jicheng Yang , Lee J. Jacobson , Sushil Bharatan , Thomas D. Chen
CPC classification number: H04R19/04 , H04R19/005
Abstract: A microphone system has a package with an interior chamber and an inlet aperture for receiving an acoustic signal, and a microphone die having a backplate and a diaphragm. The microphone is positioned within the package interior to form a front volume between the diaphragm and the inlet aperture. Accordingly, the microphone is positioned to form a back volume defined in part by the diaphragm within the interior chamber. The system also has a stop member positioned in the back volume so that the diaphragm is between the stop member and the backplate.
Abstract translation: 麦克风系统具有具有内部腔室和用于接收声学信号的入口孔口的包装，以及具有背板和隔膜的麦克风模具。 麦克风位于包装内部，以形成隔膜和入口孔之间的前部容积。 因此，麦克风被定位成形成由内部室内的隔膜部分限定的后部体积。 系统还具有定位在后部体积中的止动构件，使得隔膜位于止动构件和背板之间。
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公开(公告)号：US09002040B2
公开(公告)日：2015-04-07
申请号：US14043628
申请日：2013-10-01
Applicant: Invensense, Inc.
Inventor： Jicheng Yang
CPC classification number: B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/093 , B81C2203/0109 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R19/005 , H04R19/04 , H04R31/00 , H01L2924/00014 , H01L2924/00
Abstract: Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid is mounted to an interior surface of the package housing to define an interior lid cavity, and includes a back volume port therethrough. The MEMS microphone die is mounted on the interior lid over the back volume port, and includes a movable membrane. The back volume port is configured to allow the interior lid cavity and the MEMS movable membrane to communicate, thereby increasing the back volume of the MEMS microphone die and enhancing the sound performance of the packaged MEMS microphone device.
Abstract translation: 微机电系统（MEMS）麦克风装置及其包装方法包括封装外壳，内部盖和集成MEMS麦克风管芯。 包装壳体包括一个声音通道，用于将声音从包装外壳的外部传送到包装外壳的内部。 内部盖被安装到包装壳体的内表面以限定内部空腔，并且包括通过其的后部容积端口。 MEMS麦克风模具安装在内部盖子的后部容积端口上，并且包括可动膜。 后体积端口被配置为允许内部盖腔和MEMS可移动膜连通，从而增加MEMS麦克风管芯的后部体积并增强封装的MEMS麦克风器件的声音性能。
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公开(公告)号：US20140225203A1
公开(公告)日：2014-08-14
申请号：US14043628
申请日：2013-10-01
Applicant: Invensense, Inc.
Inventor： Jicheng Yang
IPC: B81B7/00
CPC classification number: B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/093 , B81C2203/0109 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/1461 , H01L2924/3025 , H04R19/005 , H04R19/04 , H04R31/00 , H01L2924/00014 , H01L2924/00
Abstract: Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid is mounted to an interior surface of the package housing to define an interior lid cavity, and includes a back volume port therethrough. The MEMS microphone die is mounted on the interior lid over the back volume port, and includes a movable membrane. The back volume port is configured to allow the interior lid cavity and the MEMS movable membrane to communicate, thereby increasing the back volume of the MEMS microphone die and enhancing the sound performance of the packaged MEMS microphone device.
Abstract translation: 微机电系统（MEMS）麦克风装置及其包装方法包括封装外壳，内部盖和集成MEMS麦克风管芯。 包装壳体包括一个声音通道，用于将声音从包装外壳的外部传送到包装外壳的内部。 内部盖被安装到包装壳体的内表面以限定内部空腔，并且包括通过其的后部容积端口。 MEMS麦克风模具安装在内部盖子的后部容积端口上，并且包括可动膜。 后体积端口被配置为允许内部盖腔和MEMS可移动膜连通，从而增加MEMS麦克风管芯的后部体积并增强封装的MEMS麦克风器件的声音性能。
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