Invention Grant
- Patent Title: Via structure
- Patent Title (中): 通过结构
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Application No.: US14809607Application Date: 2015-07-27
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Publication No.: US09258883B2Publication Date: 2016-02-09
- Inventor: Shih-Hsien Wu , Min-Lin Lee
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia
- Priority: TW102147473A 20131220
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02

Abstract:
A via structure includes a ground conductor, a floated conductor and a signal conductor. The ground conductor is electrically coupled to a reference potential. The floated conductor is electrically insulated from the ground conductor. The signal conductor is located between and insulated from the ground conductor and the floated conductor.
Public/Granted literature
- US20150334821A1 VIA STRUCTURE Public/Granted day:2015-11-19
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