Invention Grant
- Patent Title: Hinge assembly
- Patent Title (中): 铰链总成
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Application No.: US14126247Application Date: 2013-07-30
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Publication No.: US09258914B2Publication Date: 2016-02-09
- Inventor: Alanna M. Koser , Robert R. Atkinson, Jr. , Ralph V. Miele , Anthony P. Valpiani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- International Application: PCT/US2013/052751 WO 20130730
- International Announcement: WO2015/016838 WO 20150205
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/02

Abstract:
In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect a first section of the chassis to a second section of the chassis, comprising a hinge assembly to be coupled between the first section of the chassis and the second section of the chassis to allow rotation of the second section of the chassis with respect to the first section of the chassis, and a translation assembly to be coupled to the hinge assembly of the chassis for the electronic device to allow translation of the second section of the chassis with respect to the first section of the chassis, wherein rotation of the hinge assembly activates the translation assembly. Other embodiments may be described.
Public/Granted literature
- US20150305185A1 HINGE ASSEMBLY Public/Granted day:2015-10-22
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