公开(公告)号：US09258914B2

公开(公告)日：2016-02-09

申请号：US14126247

申请日：2013-07-30

Applicant: Intel Corporation

Inventor： Alanna M. Koser ,  Robert R. Atkinson, Jr. ,  Ralph V. Miele ,  Anthony P. Valpiani

IPC: G06F1/16 ,  H05K5/02

CPC classification number: H05K5/0226 ,  G06F1/1616 ,  G06F1/1633 ,  G06F1/1681

Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect a first section of the chassis to a second section of the chassis, comprising a hinge assembly to be coupled between the first section of the chassis and the second section of the chassis to allow rotation of the second section of the chassis with respect to the first section of the chassis, and a translation assembly to be coupled to the hinge assembly of the chassis for the electronic device to allow translation of the second section of the chassis with respect to the first section of the chassis, wherein rotation of the hinge assembly activates the translation assembly. Other embodiments may be described.

Abstract translation: 在一个实施例中，用于电子设备的底盘包括第一部分和第二部分以及将底盘的第一部分连接到底盘的第二部分的组件，包括：联接在底盘的第一部分和 所述底盘的第二部分允许所述底盘的第二部分相对于所述底盘的所述第一部分旋转;以及平移组件，其被耦合到所述机架的所述铰链组件以用于所述电子设备，以允许所述第二部分 相对于底盘的第一部分的底盘的部分，其中铰链组件的旋转激活平移组件。 可以描述其他实施例。

公开(公告)号：US20180210506A1

公开(公告)日：2018-07-26

申请号：US15689404

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC: G06F1/16

CPC classification number: G06F1/1654 ,  G06F1/1643 ,  G06F1/166 ,  G06F1/1683

Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US10481643B2

公开(公告)日：2019-11-19

申请号：US15689404

申请日：2017-08-29

Applicant: Intel Corporation

Inventor： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC: G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US20170288330A1

公开(公告)日：2017-10-05

申请号：US15084682

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Anthony P. Valpiani ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/70

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

公开(公告)号：US09244487B2

公开(公告)日：2016-01-26

申请号：US14090493

申请日：2013-11-26

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Anthony P. Valpiani ,  Barry T. Dale ,  Chia-Pin Chiu

IPC: H01R4/50 ,  G06F1/16 ,  H01R13/193 ,  H05K7/10

CPC classification number: G06F1/16 ,  H01R13/193 ,  H05K7/1007 ,  Y10T29/49826

Abstract: A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.

Abstract translation: 地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。 对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。 在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触 。

公开(公告)号：US09991223B2

公开(公告)日：2018-06-05

申请号：US14975532

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Michael R. Hui ,  Jonathon R. Carstens ,  Michael S. Brazel ,  Daniel P. Carter ,  Thomas A. Boyd ,  Shelby A. Ferguson ,  Rashelle Yee ,  Joseph J. Jasniewski ,  Harvey R. Kofstad ,  Anthony P. Valpiani

IPC: B23K3/08 ,  H04L23/00 ,  H01L23/00 ,  B23K1/00 ,  B23K101/42

CPC classification number: H01L24/75 ,  B23K1/0016 ,  B23K3/087 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/75703 ,  H01L2224/75754 ,  H01L2224/81139 ,  H01L2224/81234 ,  H01L2924/15311 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/166 ,  H05K2203/167 ,  Y02P70/613

Abstract: Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame may comprise a two frame system. The interposer may be on a mounting table or on a circuit board. The frame may include a body with a rectangular opening dimensioned to receive a semiconductor package to be coupled to the interposer. The frame may be to align a ball grid array of the semiconductor package with pads of the interposer. A second frame may be to receive the first frame and may be to align a ball grid array of the interposer with pads of the circuit board. A single frame may be used to couple a semiconductor package to an interposer and to couple the interposer to a circuit board. Other embodiments may be described and/or claimed.

公开(公告)号：US20170178994A1

公开(公告)日：2017-06-22

申请号：US14975943

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Michael Hui ,  Rashelle Yee ,  Jonathan Thibado ,  Daniel P. Carter ,  Shelby Ferguson ,  Anthony P. Valpiani ,  Russell S. Aoki ,  Jonathon Robert Carstens ,  Joseph J. Jasniewski ,  Harvey R. Kofstad ,  Michael Brazel ,  Tracy Clack ,  Viktor Vogman ,  Penny Woodcock ,  Kevin J. Ceurter ,  Hongfei Yan

IPC: H01L23/34 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L21/4853 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled to the first heater trace in the IC package support structure.

公开(公告)号：US20200218314A1

公开(公告)日：2020-07-09

申请号：US16683814

申请日：2019-11-14

Applicant: Intel Corporation

Inventor： Michael Hui ,  Russell S. Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC: G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US10680367B2

公开(公告)日：2020-06-09

申请号：US15084682

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Anthony P. Valpiani ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/77 ,  H01R13/62 ,  H01R13/639 ,  H01R12/70

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

公开(公告)号：US09766661B2

公开(公告)日：2017-09-19

申请号：US14126242

申请日：2013-07-30

Applicant: Intel Corporation

Inventor： Michael Hui ,  Russell Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC: G06F1/16

CPC classification number: G06F1/1654 ,  G06F1/1643 ,  G06F1/166 ,  G06F1/1683

Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.