Invention Grant
US09265160B2 Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
有权
电介质材料，从其形成子组件的方法以及与其形成的子组件
- Patent Title: Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
- Patent Title (中): 电介质材料，从其形成子组件的方法以及与其形成的子组件
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Application No.: US14099207Application Date: 2013-12-06
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Publication No.: US09265160B2Publication Date: 2016-02-16
- Inventor: Sankar Paul , Scott D. Kennedy , Dirk M. Baars
- Applicant: Rogers Corporation
- Applicant Address: US CT Rogers
- Assignee: ROGERS CORPORATION
- Current Assignee: ROGERS CORPORATION
- Current Assignee Address: US CT Rogers
- Agency: Cantor Colburn LLP
- Main IPC: H05K3/46
- IPC: H05K3/46 ; B32B7/12 ; B32B15/14 ; C08G65/48 ; C08L71/12 ; C09J107/00 ; C09J113/00 ; C09J171/12 ; H05K3/00 ; C08K3/00 ; C08L9/00 ; C08L13/00 ; C08L15/00 ; C08L19/00 ; C08L51/04 ; H05K1/03
Abstract:
A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.
Public/Granted literature
- US20140090767A1 DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, AND THE SUBASSEMBLIES FORMED THEREWITH Public/Granted day:2014-04-03
Information query
