公开(公告)号：US20140090767A1

公开(公告)日：2014-04-03

申请号：US14099207

申请日：2013-12-06

Applicant: Rogers Corporation

Inventor： Sankar Paul ,  Scott D. Kennedy ,  Dirk M. Baars

IPC: H05K3/00

CPC classification number: H05K3/4626 ,  B32B3/04 ,  B32B3/08 ,  B32B3/18 ,  B32B3/30 ,  B32B5/08 ,  B32B5/16 ,  B32B5/30 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/14 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/7265 ,  B32B2457/00 ,  B32B2457/08 ,  C08G65/485 ,  C08K3/013 ,  C08L9/00 ,  C08L13/00 ,  C08L15/00 ,  C08L19/006 ,  C08L51/04 ,  C08L71/12 ,  C08L71/126 ,  C08L2666/08 ,  C08L2666/14 ,  C09J107/00 ,  C09J113/00 ,  C09J171/12 ,  H05K1/0393 ,  H05K3/00 ,  H05K3/462 ,  H05K3/4641 ,  H05K3/4676 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0355 ,  H05K2201/10378 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/263 ,  Y10T428/31544 ,  Y10T428/31931 ,  C08L2666/04

Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Abstract translation: 一种电路子组件，包括由电介质组合物形成的电介质层，所述电介质层包含基于所述组合物的总体积：约15至约65体积％的介电填料; 和约35至约85体积％的热固性组合物，其包含：聚（亚芳基醚）和羧基官能化聚丁二烯或聚异戊二烯聚合物。

公开(公告)号：US09265160B2

公开(公告)日：2016-02-16

申请号：US14099207

申请日：2013-12-06

Applicant: Rogers Corporation

Inventor： Sankar Paul ,  Scott D. Kennedy ,  Dirk M. Baars

IPC: H05K3/46 ,  B32B7/12 ,  B32B15/14 ,  C08G65/48 ,  C08L71/12 ,  C09J107/00 ,  C09J113/00 ,  C09J171/12 ,  H05K3/00 ,  C08K3/00 ,  C08L9/00 ,  C08L13/00 ,  C08L15/00 ,  C08L19/00 ,  C08L51/04 ,  H05K1/03

CPC classification number: H05K3/4626 ,  B32B3/04 ,  B32B3/08 ,  B32B3/18 ,  B32B3/30 ,  B32B5/08 ,  B32B5/16 ,  B32B5/30 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/14 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/7265 ,  B32B2457/00 ,  B32B2457/08 ,  C08G65/485 ,  C08K3/013 ,  C08L9/00 ,  C08L13/00 ,  C08L15/00 ,  C08L19/006 ,  C08L51/04 ,  C08L71/12 ,  C08L71/126 ,  C08L2666/08 ,  C08L2666/14 ,  C09J107/00 ,  C09J113/00 ,  C09J171/12 ,  H05K1/0393 ,  H05K3/00 ,  H05K3/462 ,  H05K3/4641 ,  H05K3/4676 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0355 ,  H05K2201/10378 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/263 ,  Y10T428/31544 ,  Y10T428/31931 ,  C08L2666/04

Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Abstract translation: 一种电路子组件，包括由电介质组合物形成的电介质层，所述电介质层包含基于所述组合物的总体积：约15至约65体积％的介电填料; 和约35至约85体积％的热固性组合物，其包含：聚（亚芳基醚）和羧基官能化聚丁二烯或聚异戊二烯聚合物。

公开(公告)号：US20150351237A1

公开(公告)日：2015-12-03

申请号：US14723734

申请日：2015-05-28

Applicant: Rogers Corporation

Inventor： William F. Scholz ,  Sankar Paul

IPC: H05K1/05 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08K5/5313 ,  H05K3/4655 ,  H05K2201/012 ,  H05K2201/0195 ,  Y10T156/10 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/2495

Abstract: A circuit subassembly, comprising a conductive layer, a dielectric layer is formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition, a low polarity resin, a oxaphosphorinoxide-containing aromatic compound, and an protective adhesive layer disposed between the conductive layer and the dielectric layer, wherein the circuit subassembly has a UL-94 rating of at least V-0. Also disclosed is a composition for a bond ply and a circuit subassembly that further comprises such bond ply.

Abstract translation: 包含导电层，电介质层的电路子组件由热固性组合物形成，其中热固性组合物基于热固性组合物的总重量包括低极性树脂，含有氧化磷酰氧基的芳族化合物和保护性 粘合层设置在导电层和电介质层之间，其中电路子组件的UL-94等级至少为V-0。 还公开了一种用于粘结层和电路子组件的组合物，其还包括这种键合层。

公开(公告)号：US10104769B2

公开(公告)日：2018-10-16

申请号：US14723734

申请日：2015-05-28

Applicant: Rogers Corporation

Inventor： William F. Scholz ,  Sankar Paul

IPC: H05K1/03 ,  H05K3/46 ,  C08K5/53 ,  C08K5/5313

Abstract: A circuit subassembly, comprising a conductive layer, a dielectric layer is formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition, a low polarity resin, a oxaphosphorinoxide-containing aromatic compound, and an protective adhesive layer disposed between the conductive layer and the dielectric layer, wherein the circuit subassembly has a UL-94 rating of at least V-0. Also disclosed is a composition for a bond ply and a circuit subassembly that further comprises such bond ply.