A multilayer electronic support structure comprising a plurality of layers extending in an X-Y plane consisting of a dielectric material surrounding metal via posts that conduct in a Z direction perpendicular to the X-Y plane, wherein a stacked via structure crossing at least two via layers of the plurality of layers comprises at least two via posts in neighboring via layers wherein the at least two stacked via posts in neighboring layers have different dimensions in the X-Y plane, such that the stacked via structure tapers.