Invention Grant
US09269604B2 Wafer edge warp suppression for thin wafer supported by tape frame
有权
用于由胶带框支撑的薄晶片的晶圆边缘翘曲抑制
- Patent Title: Wafer edge warp suppression for thin wafer supported by tape frame
- Patent Title (中): 用于由胶带框支撑的薄晶片的晶圆边缘翘曲抑制
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Application No.: US14542422Application Date: 2014-11-14
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Publication No.: US09269604B2Publication Date: 2016-02-23
- Inventor: Wei-Sheng Lei , Brad Eaton , Ajay Kumar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: H01L21/301
- IPC: H01L21/301 ; H01L21/683 ; H01L21/78 ; H01L21/3065 ; H01L21/308 ; H01L21/67 ; B32B37/00 ; B32B37/22 ; B32B3/26
Abstract:
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of reducing edge warping in a supported semiconductor wafer involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier comprising a tape frame mounted above the carrier tape. The method also involves adhering an adhesive tape to a front side of the semiconductor wafer and to at least a portion of the substrate carrier. The adhesive tape includes an opening exposing an inner region of the front side of the semiconductor wafer.
Public/Granted literature
- US20150311107A1 WAFER EDGE WARP SUPPRESSION FOR THIN WAFER SUPPORTED BY TAPE FRAME Public/Granted day:2015-10-29
Information query
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