A surface mount electrical interconnect adapted to provide an interface between contact pads on an LGA device and a PCB. The electrical interconnect includes a socket substrate having a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of contact members are located in the socket substrate such that first contact tips are located proximate the first openings, second contact tips are located proximate the second openings, and center portions located in the center openings.