Invention Grant
- Patent Title: Digital embossing
- Patent Title (中): 数字压花
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Application No.: US14152281Application Date: 2014-01-10
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Publication No.: US09279058B2Publication Date: 2016-03-08
- Inventor: Darko Pervan , Tony Pervan
- Applicant: Floor Iptech AB
- Applicant Address: SE Viken
- Assignee: FLOOR IPTECH AB
- Current Assignee: FLOOR IPTECH AB
- Current Assignee Address: SE Viken
- Agency: Buchanan Ingersoll & Rooney P.C.
- Main IPC: B41M1/24
- IPC: B41M1/24 ; C09D11/103 ; B41F17/00 ; B41J2/32 ; B41J2/325 ; B05D3/00 ; B05D3/06 ; B41M5/50 ; B41J11/00 ; B41J3/28 ; B41J3/407 ; B44C1/24 ; B44C5/04 ; C08K3/22 ; C09D197/02
Abstract:
A method of forming a digital embossing (17) on a surface (2) by bonding hard press particles (67) to a carrier (68). A liquid binder pattern (P) is applied on the carrier by a digital drop application head. Hard press particles (67) are applied on the carrier (68) and the binder pattern such that some hard press particles are bonded to the carrier (68) by the liquid pattern and non-bonded press particles (67) are removed. The carrier (68) with the bonded hard press particles (67) is pressed to the surface (2) and an embossing is formed when the carrier (68) with the hard press particles (67) is removed.
Public/Granted literature
- US20140196618A1 DIGITAL EMBOSSING Public/Granted day:2014-07-17
Information query
