Invention Grant
US09279180B2 Machine for plasma treatment of containers comprising an integrated vacuum circuit 有权
用于等离子体处理包括集成真空电路的容器的机器

Machine for plasma treatment of containers comprising an integrated vacuum circuit
Abstract:
A machine for plasma treatment of containers, including a chamber for receiving a container to be treated, the chamber connected to a primary vacuum circuit. A pressure sensor is connected to the chamber. There is a first mechanism for communicating the pressure sensor with the chamber; a secondary vacuum circuit dependent on the first circuit and connected to the pressure sensor; and second mechanism for communicating the pressure sensor with the secondary vacuum circuit.
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