A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.