Invention Grant
- Patent Title: Method of making micro-channel structure for micro-wires
- Patent Title (中): 微线微通道结构的制作方法
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Application No.: US13746346Application Date: 2013-01-22
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Publication No.: US09282647B2Publication Date: 2016-03-08
- Inventor: David Paul Trauernicht , John Andrew Lebens , Yongcai Wang
- Applicant: David Paul Trauernicht , John Andrew Lebens , Yongcai Wang
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Raymond L. Owens; Kevin E. Spaulding
- Main IPC: H05K3/12
- IPC: H05K3/12 ; B05D5/12 ; B05D3/10 ; H01Q1/38 ; G06F3/041 ; H05K1/02 ; H05K1/09 ; H05K1/16 ; H05K3/00

Abstract:
A method of making a micro-channel structure and applying a curable ink to the micro-channel structure includes providing a substrate and depositing a single layer of a curable polymer on the substrate, the single curable layer having a layer thickness. One or more micro-channels adapted to receive curable ink are embossed into the single curable layer, the micro-channels having a micro-channel thickness that is in a range of two microns to ten microns less than the layer thickness. The single curable layer is cured to form a single cured layer so that deformations of the micro-channels or the surface of the single cured layer are reduced. Curable ink is coated over the surface and micro-channels of the single cured layer. The curable ink is removed from the surface of the single cured layer and the curable ink is cured.
Public/Granted literature
- US20140205810A1 METHOD OF MAKING MICRO-CHANNEL STRUCTURE FOR MICRO-WIRES Public/Granted day:2014-07-24
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