Invention Grant
US09295158B2 Method of manufacturing printed circuit board having electronic component embedded 有权
具有嵌入电子部件的印刷电路板的制造方法

Method of manufacturing printed circuit board having electronic component embedded
Abstract:
A printed circuit board having an electronic component embedded and a method making the same are disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.
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