Invention Grant
- Patent Title: Method of manufacturing printed circuit board having electronic component embedded
- Patent Title (中): 具有嵌入电子部件的印刷电路板的制造方法
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Application No.: US14071724Application Date: 2013-11-05
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Publication No.: US09295158B2Publication Date: 2016-03-22
- Inventor: Chi-Chou Lin
- Applicant: SunASIC Technologies, Inc.
- Applicant Address: TW New Taipei
- Assignee: Sunasic Technologies, Inc.
- Current Assignee: Sunasic Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: Law Office of Michael Chen
- Agent Che-Yang Chen
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K1/18 ; B42D25/313 ; H05K3/00 ; H05K3/40 ; H05K3/42 ; H05K3/46

Abstract:
A printed circuit board having an electronic component embedded and a method making the same are disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.
Public/Granted literature
- US20150124416A1 PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-05-07
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