Invention Grant
- Patent Title: Semiconductor device, nitride semiconductor wafer, and method for forming nitride semiconductor layer
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Application No.: US14744153Application Date: 2015-06-19
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Publication No.: US09305773B2Publication Date: 2016-04-05
- Inventor: Hung Hung , Naoharu Sugiyama , Hisashi Yoshida , Toshiki Hikosaka , Yoshiyuki Harada , Shinya Nunoue
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-207626 20120920
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/02 ; H01L33/00 ; H01L33/12 ; H01L33/32 ; H01L29/20 ; H01L29/207 ; H01L29/06 ; H01L29/201 ; H01L29/36 ; H01L31/18

Abstract:
According to one embodiment, a semiconductor device includes a functional layer of a nitride semiconductor. The functional layer is provided on a nitride semiconductor layer including a first stacked multilayer structure provided on a substrate. The first stacked multilayer structure includes a first lower layer, a first intermediate layer, and a first upper layer. The first lower layer contains Si with a first concentration and has a first thickness. The first intermediate layer is provided on the first lower layer to be in contact with the first lower layer, contains Si with a second concentration lower than the first concentration, and has a second thickness thicker than the first thickness. The first upper layer is provided on the first intermediate layer to be in contact with the first intermediate layer, contains Si with a third concentration lower than the second concentration, and has a third thickness.
Public/Granted literature
- US20150287589A1 SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR FORMING NITRIDE SEMICONDUCTOR LAYER Public/Granted day:2015-10-08
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