Invention Grant
- Patent Title: Semiconductor device and integrated apparatus comprising the same
- Patent Title (中): 半导体装置及其一体化装置
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Application No.: US14527815Application Date: 2014-10-30
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Publication No.: US09306064B2Publication Date: 2016-04-05
- Inventor: Uwe Wahl , Armin Willmeroth
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Eschweiler & Associates, LLC
- Priority: CN201320675145 20131030
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40 ; H01L27/088 ; H02M1/08 ; H02M1/42 ; H02M3/335

Abstract:
The present disclosure provides a semiconductor device and an integrated apparatus having the same. The semiconductor device includes a substrate, a buffer layer on the substrate, a compensation area which includes a p-region and a n-region on the buffer layer, and a transistor cell on the compensation area. The transistor cell includes a source region, a body region, a gate electrode and a gate dielectric formed at least between the gate electrode and the body region. The gate dielectric has a thickness in a range of 12 nm to 50 nm.
Public/Granted literature
- US20150116031A1 Semiconductor Device and Integrated Apparatus Comprising the same Public/Granted day:2015-04-30
Information query
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