Invention Grant
- Patent Title: Bonding apparatus and method
- Patent Title (中): 接合装置及方法
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Application No.: US13911560Application Date: 2013-06-06
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Publication No.: US09308709B2Publication Date: 2016-04-12
- Inventor: James Madsen
- Applicant: Fenwal, Inc.
- Applicant Address: US IL Lake Zurich
- Assignee: Fenwal, Inc.
- Current Assignee: Fenwal, Inc.
- Current Assignee Address: US IL Lake Zurich
- Agency: Cook Alex Ltd.
- Main IPC: B29C65/20
- IPC: B29C65/20 ; B32B37/00 ; B29C65/78 ; B29C65/00 ; B29C65/02 ; B32B37/04 ; B29L31/00 ; B29C65/18
Abstract:
Apparatus and method are disclosed for heat bonding or welding a thermoplastic component to a sealing member such as a film or foil having a thermoplastic portion. The apparatus preferably includes a 3-axis arrangement for accurate and repeatable positioning of the component and foil during bonding and for variation of bonding parameters, such as material, pressure, temperature and/or time.
Public/Granted literature
- US20140360668A1 BONDING APPARATUS AND METHOD Public/Granted day:2014-12-11
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