Invention Grant
- Patent Title: Light receiving element, semiconductor epitaxial wafer, method for manufacturing the light receiving element, method for manufacturing the semiconductor epitaxial wafer, and detecting device
- Patent Title (中): 光接收元件,半导体外延晶片,用于制造光接收元件的方法,制造半导体外延晶片的方法和检测器件
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Application No.: US13991129Application Date: 2011-11-29
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Publication No.: US09312422B2Publication Date: 2016-04-12
- Inventor: Kohei Miura , Hiroshi Inada , Yasuhiro Iguchi , Tadashi Saito
- Applicant: Kohei Miura , Hiroshi Inada , Yasuhiro Iguchi , Tadashi Saito
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2010-268614 20101201; WOPCT/JP2011/061407 20110518; JP2011-248788 20111114
- International Application: PCT/JP2011/077481 WO 20111129
- International Announcement: WO2012/073934 WO 20120607
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/109 ; B82Y20/00 ; H01L27/144 ; H01L31/0352 ; H01L31/075 ; H01L21/02 ; H01L31/0304 ; H01L31/105 ; H01L31/18 ; H01L27/146

Abstract:
A light receiving element includes an InP substrate that is transparent to light having a wavelength of 3 to 12 μm, a buffer layer located in contact with the InP substrate, and a light-receiving layer having a multiple quantum well structure, the light-receiving layer having a cutoff wavelength of 3 μm or more and being lattice-matched with the buffer layer. In the light receiving element, the buffer layer is epitaxially grown on the InP substrate while the buffer layer and the InP substrate exceed a range of a normal lattice-matching condition, and the buffer layer is constituted by a GaSb layer.
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