Invention Grant
- Patent Title: Multilayer electronic structure with novel transmission lines
- Patent Title (中): 传输线新颖多层电子结构
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Application No.: US13483234Application Date: 2012-05-30
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Publication No.: US09312593B2Publication Date: 2016-04-12
- Inventor: Dror Hurwitz
- Applicant: Dror Hurwitz
- Applicant Address: CN Zhuhai
- Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee Address: CN Zhuhai
- Agency: Wiggin and Dana LLP
- Agent Gregory S. Rosenblatt; Jonathan D. Hall
- Main IPC: H01P11/00
- IPC: H01P11/00 ; H01P3/08 ; H05K1/02 ; H05K3/46

Abstract:
A signal carrier for carrying a signal in a direction within the X-Y plane of a multilayer composite electronic structure comprising a plurality of dielectric layers extending in an X-Y plane, the signal carrier comprising a first transmission line comprising a lower continuous metallic layer and further comprising a row of metallic via posts coupled to the continuous metal layer, wherein the transmission line is separated by a dielectric material from an underlying reference plane.
Public/Granted literature
- US20130321104A1 MULTILAYER ELECTRONIC STRUCTURE WITH NOVEL TRANSMISSION LINES Public/Granted day:2013-12-05
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