Invention Grant
- Patent Title: Wireless chip
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Application No.: US14140114Application Date: 2013-12-24
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Publication No.: US09318800B2Publication Date: 2016-04-19
- Inventor: Shunpei Yamazaki , Konami Izumi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2005-129326 20050427
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; G06K19/04 ; G06K19/077 ; H01L27/12

Abstract:
The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.
Public/Granted literature
- US20140111385A1 WIRELESS CHIP Public/Granted day:2014-04-24
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