公开(公告)号：US09130012B2

公开(公告)日：2015-09-08

申请号：US14289748

申请日：2014-05-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Mayumi Yamaguchi ,  Konami Izumi

IPC: H01L21/20 ,  H01L21/762 ,  B81C3/00 ,  B32B38/10

CPC classification number: H01L21/762 ,  B32B38/10 ,  B81C3/008 ,  B81C2201/019 ,  Y10T428/24802

Abstract: Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.

Abstract translation: 没有牺牲层蚀刻，制造微结构和微机械。 在基板101上形成分离层102，在分离层102的上方形成作为可动电极的层103.在分离层102的界面处，作为可动电极的层103与基板分离 。 作为固定电极的层106形成在另一基板105上。作为可动电极的层103被固定到基板105，间隔层103被部分地设置在其间，使得层103成为可移动的 电极和作为固定电极的层106彼此面对。

公开(公告)号：US20140370639A1

公开(公告)日：2014-12-18

申请号：US14472598

申请日：2014-08-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Mayumi Yamaguchi ,  Konami Izumi ,  Fuminori Tateishi

IPC: H01L23/00 ,  H01L21/54 ,  H01L35/34 ,  H01L21/02 ,  H01L41/25

CPC classification number: B60C23/0493 ,  A61B5/02444 ,  A61B5/681 ,  B60C23/04 ,  B60C23/0408 ,  B60C23/0411 ,  B60C23/0413 ,  B60C23/20 ,  B81C1/0023 ,  G01L1/16 ,  G01L17/00 ,  H01L21/02118 ,  H01L21/02175 ,  H01L21/02183 ,  H01L21/02186 ,  H01L21/02189 ,  H01L21/54 ,  H01L24/93 ,  H01L27/20 ,  H01L35/34 ,  H01L41/25 ,  H01L41/311 ,  H01L41/313 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  Y10T29/42 ,  H01L2924/00

Abstract: The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.

Abstract translation: 本发明提供一种具有MEMS的MEMS和传感器，该传感器可以在没有蚀刻牺牲层的工艺的情况下形成。 具有MEMS的MEMS和传感器通过使用间隔层形成间隙而形成。 在使用间隔层形成间隙的MEMS中，不需要用于形成牺牲层的工艺和牺牲层的蚀刻工艺。 结果，蚀刻时间没有限制，可以提高成品率。

公开(公告)号：US08759887B2

公开(公告)日：2014-06-24

申请号：US13908688

申请日：2013-06-03

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Mayumi Yamaguchi ,  Konami Izumi

IPC: H01L29/84

CPC classification number: H01L29/84 ,  B81B2201/034 ,  B81C1/00246 ,  B81C2203/0742

Abstract: To manufacture a micro structure and an electric circuit included in a micro electro mechanical device over the same insulating surface in the same step. In the micro electro mechanical device, an electric circuit including a transistor and a micro structure are integrated over a substrate having an insulating surface. The micro structure includes a structural layer having the same stacked-layer structure as a layered product of a gate insulating layer of the transistor and a semiconductor layer provided over the gate insulating layer. That is, the structural layer includes a layer formed of the same insulating film as the gate insulating layer and a layer formed of the same semiconductor film as the semiconductor layer of the transistor. Further, the micro structure is manufactured by using each of conductive layers used for a gate electrode, a source electrode, and a drain electrode of the transistor as a sacrificial layer.

Abstract translation: 在相同的步骤中，在相同的绝缘表面上制造包括在微机电装置中的微结构和电路。 在微机电装置中，包括晶体管和微结构的电路集成在具有绝缘表面的基板上。 微结构包括具有与晶体管的栅极绝缘层的层叠体和设置在栅极绝缘层上的半导体层相同的层叠结构的结构层。 也就是说，结构层包括由与绝缘层相同的绝缘膜形成的层和由与晶体管的半导体层相同的半导体膜形成的层。 此外，通过使用用作晶体管的栅电极，源电极和漏电极的导电层作为牺牲层来制造微结构。

公开(公告)号：US20130119561A1

公开(公告)日：2013-05-16

申请号：US13729270

申请日：2012-12-28

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Koji Dairiki ,  Konami Izumi

IPC: H01L23/52

CPC classification number: H01L25/0657 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5385 ,  H01L23/58 ,  H01L23/645 ,  H01L23/66 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/285 ,  H01Q13/10 ,  H01Q23/00 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: To provide a semiconductor device in which wireless communication is performed between devices formed over different substrates and connection defects of wirings are reduced. A first device having a first antenna is provided over a first substrate, a second device having a second antenna which can communicate with the first antenna is provided over a second substrate, and the first substrate and the second substrate are bonded to each other to manufacture a semiconductor device. The first substrate and the second substrate are bonded to each other by bonding with a bonding layer interposed therebetween, anodic bonding, or surface activated bonding.

Abstract translation: 为了提供在不同基板之间形成的器件之间执行无线通信的半导体器件，并且布线的连接缺陷被减少。 具有第一天线的第一装置设置在第一基板上，具有可与第一天线连通的第二天线的第二装置设置在第二基板上，并且第一基板和第二基板彼此接合以制造 半导体器件。 第一基板和第二基板通过与其间的接合层的粘合，阳极接合或表面活性接合而彼此接合。

公开(公告)号：US09767406B2

公开(公告)日：2017-09-19

申请号：US15095549

申请日：2016-04-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Konami Izumi

IPC: H01Q1/38 ,  G06K19/077 ,  G06K19/04 ,  H01L27/12

CPC classification number: G06K19/07775 ,  G06K19/04 ,  G06K19/07749 ,  H01L27/1214 ,  H01L27/1266 ,  H01Q1/38

Abstract: The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.

公开(公告)号：US09590277B2

公开(公告)日：2017-03-07

申请号：US15214562

申请日：2016-07-20

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Konami Izumi

IPC: H01M10/0585 ,  H01M10/0525 ,  H01M4/66 ,  H01M10/0562 ,  C23C14/06 ,  C23C14/14 ,  C23C14/58 ,  H01G11/86 ,  H01G11/68 ,  H01G11/56 ,  H01G11/28 ,  C23C14/34 ,  C23C14/10

CPC classification number: H01M10/0585 ,  C23C14/0676 ,  C23C14/10 ,  C23C14/14 ,  C23C14/34 ,  C23C14/58 ,  H01G9/016 ,  H01G9/155 ,  H01G11/28 ,  H01G11/56 ,  H01G11/68 ,  H01G11/80 ,  H01G11/84 ,  H01G11/86 ,  H01M4/661 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0562 ,  Y02E60/13 ,  Y10T29/49115

Abstract: A power storage device having a small thickness is manufactured. A manufacturing method of the power storage device includes: forming a first layer and a second layer over a first substrate; forming a first insulating layer, a positive electrode and a negative electrode over the second layer; forming a solid electrolyte layer over the first insulating layer, the positive electrode, and the negative electrode; forming a sealing layer to cover the solid electrolyte layer; forming a planarization film and a support over the sealing layer; separating the first layer and the second layer from each other so that the second layer, the positive electrode, the negative electrode, the solid electrolyte layer, the sealing layer, the planarization film, and the support are separated from the first substrate; attaching the separated structure to a second substrate which is flexible; and separating the support from the planarization film.

Abstract translation: 制造厚度小的蓄电装置。 蓄电装置的制造方法包括：在第一基板上形成第一层和第二层; 在第二层上形成第一绝缘层，正极和负极; 在所述第一绝缘层，所述正极和所述负极上形成固体电解质层; 形成覆盖固体电解质层的密封层; 在所述密封层上形成平坦化膜和支撑体; 将第一层和第二层彼此分离，使得第二层，正极，负极，固体电解质层，密封层，平坦化膜和载体与第一基板分离; 将分离的结构附接到柔性的第二基底; 并将载体与平坦化膜分离。

公开(公告)号：US09389720B2

公开(公告)日：2016-07-12

申请号：US14470967

申请日：2014-08-28

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Yoshiyuki Kurokawa ,  Konami Izumi

IPC: G06F3/041 ,  G06F3/042 ,  G02F1/1333 ,  G09G3/36 ,  B81B3/00 ,  H01L21/12 ,  H01L27/144 ,  H01L27/12

CPC classification number: G06F3/0421 ,  B81B3/0021 ,  B81B2201/0264 ,  G02F1/13338 ,  G02F2201/44 ,  G06F3/0412 ,  G06F3/0416 ,  G06F3/042 ,  G09G3/3648 ,  H01L27/1225 ,  H01L27/1446

Abstract: To provide a touch panel with reduced disturbance of display and with improved mechanical strength by suppressing variation in the space between a pair of substrates which form the touch panel even when in contact with an object to be detected. A pixel portion including a plurality of pixels is provided between a pair of substrates. Each pixel includes a photosensor portion which detects that the object to be detected is in contact with one of the pair of substrates, and a MEMS portion which generates a mechanical displacement in a direction perpendicular to the pair of substrates when a signal based on a detection result of the photosensor portion is input.

Abstract translation: 通过抑制形成触摸面板的一对基板之间的空间的变化，即使在与被检测物接触的情况下，也能够提供具有降低的显示干扰和改善的机械强度的触摸面板。 包括多个像素的像素部分设置在一对基板之间。 每个像素包括光电传感器部分，其检测待检测对象与一对基板中的一个接触;以及MEMS部分，当基于检测的信号时，在垂直于该对基板的方向上产生机械位移的MEMS部分 输入光电传感器部分的结果。

公开(公告)号：US09626618B2

公开(公告)日：2017-04-18

申请号：US15095549

申请日：2016-04-11

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Konami Izumi

IPC: H01Q1/38 ,  G06K19/077 ,  G06K19/04 ,  H01L27/12

Abstract: The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.

公开(公告)号：US09406978B2

公开(公告)日：2016-08-02

申请号：US14661023

申请日：2015-03-18

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Shunpei Yamazaki ,  Konami Izumi

IPC: H01M10/058 ,  C23F4/00 ,  H01G11/26 ,  H01G11/28 ,  H01G11/52 ,  H01G11/68 ,  H01M4/13 ,  H01M4/36 ,  H01M10/052 ,  H01G9/008 ,  H01G9/02 ,  H01G9/022 ,  H01G9/04 ,  H01G9/00 ,  H01M4/04 ,  H01M4/139 ,  H01G11/24 ,  H01G11/60 ,  H01M2/16 ,  H01M4/66 ,  H01M10/0525 ,  H01M10/0566 ,  H01M10/0569 ,  H01M4/02

CPC classification number: H01M10/058 ,  C23F4/00 ,  H01G9/016 ,  H01G9/02 ,  H01G9/038 ,  H01G9/058 ,  H01G9/155 ,  H01G11/24 ,  H01G11/26 ,  H01G11/28 ,  H01G11/52 ,  H01G11/60 ,  H01G11/68 ,  H01M2/16 ,  H01M4/0404 ,  H01M4/13 ,  H01M4/139 ,  H01M4/366 ,  H01M4/661 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0566 ,  H01M10/0569 ,  H01M2004/021 ,  H01M2300/0025 ,  Y02E60/122 ,  Y02E60/13 ,  Y02P70/54 ,  Y10T29/49115

Abstract: The present invention relates to a power storage device including: a positive electrode having a positive-electrode current collector, a positive-electrode active material with a plurality of first projections on the positive-electrode current collector, and a first insulator on an end of each of the plurality of first projections; a negative electrode having a negative-electrode current collector, a negative-electrode active material with a plurality of second projections on a surface of the negative-electrode current collector, and a second insulator on an end of each of the plurality of second projections; a separator between the positive electrode and the negative electrode; and an electrolyte provided in a space between the positive electrode and the negative electrode and containing carrier ions. In each of the first projections and the second projections, a ratio of the height to the width is 3 or more and 1000 or less to 1, i.e. (3 to 1000):1.

公开(公告)号：US09318800B2

公开(公告)日：2016-04-19

申请号：US14140114

申请日：2013-12-24

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Konami Izumi

IPC: H01Q1/38 ,  G06K19/04 ,  G06K19/077 ,  H01L27/12

CPC classification number: G06K19/07775 ,  G06K19/04 ,  G06K19/07749 ,  H01L27/1214 ,  H01L27/1266 ,  H01Q1/38

Abstract: The invention provides a wireless chip which can secure the safety of consumers while being small in size, favorable in communication property, and inexpensive, and the invention also provides an application thereof. Further, the invention provides a wireless chip which can be recycled after being used for managing the manufacture, circulation, and retail. A wireless chip includes a layer including a semiconductor element, and an antenna. The antenna includes a first conductive layer, a second conductive layer, and a dielectric layer sandwiched between the first conductive layer and the second conductive layer, and has a spherical shape, an ovoid shape, an oval spherical shape like a go stone, an oval spherical shape like a rugby ball, or a disc shape, or has a cylindrical shape or a polygonal prism shape in which an outer edge portion thereof has a curved surface.