Invention Grant
- Patent Title: Adhesive, thermally conductive, electrical insulators
- Patent Title (中): 粘合剂,导热,电绝缘体
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Application No.: US13759741Application Date: 2013-02-05
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Publication No.: US09321949B2Publication Date: 2016-04-26
- Inventor: Yousen Wang , Jingqi Zhao
- Applicant: Laird Technologies, Inc.
- Applicant Address: US MO Earth City
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Earth City
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: C09K5/08
- IPC: C09K5/08 ; C09K5/14 ; H05K7/20 ; C08L83/04

Abstract:
According to various aspects, exemplary embodiments are disclosed of adhesive, thermally conductive electrically insulators. In an exemplary embodiment, a thermally conductive, electrically insulating material includes 4 to 40 parts by weight of a macromolecular matrix material; 1 to 20 parts by weight of an adhesive additive; and 40 to 85 parts by weight of thermally conductive electrically insulating particles. The adhesive additive includes a reactive group that is the same as or similar to at least one curable active group in the macromolecular matrix material.
Public/Granted literature
- US20130148303A1 ADHESIVE, THERMALLY CONDUCTIVE, ELECTRICAL INSULATORS Public/Granted day:2013-06-13
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