公开(公告)号：US10566262B2

公开(公告)日：2020-02-18

申请号：US16127853

申请日：2018-09-11

Applicant: Laird Technologies, Inc.

Inventor： Jingqi Zhao ,  Licai Jiao

IPC: H01L31/0203 ,  H01L23/373 ,  H01L31/024 ,  H01L23/31

Abstract: Exemplary embodiments are disclosed of thermal interface materials with wear-resisting layers and/or suitable for use between sliding components. Also disclosed are devices including thermal interface materials and methods of using thermal interface materials.

公开(公告)号：US09321949B2

公开(公告)日：2016-04-26

申请号：US13759741

申请日：2013-02-05

Applicant: Laird Technologies, Inc.

Inventor： Yousen Wang ,  Jingqi Zhao

IPC: C09K5/08 ,  C09K5/14 ,  H05K7/20 ,  C08L83/04

CPC classification number: C09K5/08 ,  C08K3/013 ,  C08L83/00 ,  C08L83/04 ,  C09K5/14 ,  H05K7/2039 ,  C08K3/0033

Abstract: According to various aspects, exemplary embodiments are disclosed of adhesive, thermally conductive electrically insulators. In an exemplary embodiment, a thermally conductive, electrically insulating material includes 4 to 40 parts by weight of a macromolecular matrix material; 1 to 20 parts by weight of an adhesive additive; and 40 to 85 parts by weight of thermally conductive electrically insulating particles. The adhesive additive includes a reactive group that is the same as or similar to at least one curable active group in the macromolecular matrix material.

Abstract translation: 根据各个方面，公开了粘合剂，导热电绝缘体的示例性实施例。 在示例性实施例中，导热的电绝缘材料包括4至40重量份的大分子基质材料; 1〜20重量份的粘合剂添加剂; 和40至85重量份的导热电绝缘颗粒。 粘合剂添加剂包括与大分子基体材料中的至少一种可固化活性基团相同或类似的反应性基团。

公开(公告)号：US11008424B2

公开(公告)日：2021-05-18

申请号：US16531552

申请日：2019-08-05

Applicant: Laird Technologies, Inc.

Inventor： Jingbo Shen ,  Mandy Feng ,  Jingqi Zhao

IPC: C08G77/62 ,  C09D183/04 ,  C08L67/03 ,  C09D143/04 ,  C08G77/20

Abstract: Disclosed are exemplary embodiments of systems and methods for controllably changing (e.g., weaken, strengthen, eliminate, add, customize, alter, etc.) surface tack of thermal interface materials. Also disclosed are exemplary embodiments of thermal interface material assemblies, which include coatings configured to change surface tack of the thermal interface materials.

公开(公告)号：US10370500B2

公开(公告)日：2019-08-06

申请号：US15670249

申请日：2017-08-07

Applicant: Laird Technologies, Inc.

Inventor： Jingbo Shen ,  Mandy Feng ,  Jingqi Zhao

IPC: C08G77/62 ,  C08L67/03 ,  C09D143/04 ,  C09D183/04 ,  H01L23/373 ,  H01L23/42 ,  C08G77/20

Abstract: Disclosed are exemplary embodiments of systems and methods for controllably changing (e.g., weaken, strengthen, eliminate, add, customize, alter, etc.) surface tack of thermal interface materials. Also disclosed are exemplary embodiments of thermal interface material assemblies, which include coatings configured to change surface tack of the thermal interface materials.

公开(公告)号：US20180044480A1

公开(公告)日：2018-02-15

申请号：US15670249

申请日：2017-08-07

Applicant: Laird Technologies, Inc.

Inventor： Jingbo Shen ,  Mandy Feng ,  Jingqi Zhao

IPC: C08G77/62 ,  C09D143/04 ,  C08L67/03

CPC classification number: C08G77/62 ,  B32B2398/00 ,  C08G77/20 ,  C08L67/03 ,  C09D143/04 ,  C09D183/04 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42

Abstract: Disclosed are exemplary embodiments of systems and methods for controllably changing (e.g., weaken, strengthen, eliminate, add, customize, alter, etc.) surface tack of thermal interface materials. Also disclosed are exemplary embodiments of thermal interface material assemblies, which include coatings configured to change surface tack of the thermal interface materials.