Invention Grant
- Patent Title: Three-dimensional semiconductor image reconstruction apparatus and method
- Patent Title (中): 三维半导体图像重建装置及方法
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Application No.: US14536313Application Date: 2014-11-07
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Publication No.: US09324178B2Publication Date: 2016-04-26
- Inventor: Wen-Hao Cheng , Chih-Chiang Tu , Chung-Min Fu , Ajay Nandoriya
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01J37/28
- IPC: H01J37/28 ; G06T15/10 ; G01N23/203 ; H01J37/26
Abstract:
A system comprises an electron beam directed toward a three-dimensional object with one tilting angle and at least two azimuth angles, a detector configured to receive a plurality of scanning electron microscope (SEM) images from the three-dimensional object and a processor configured to calculate a height and a sidewall edge of the three-dimensional object.
Public/Granted literature
- US20150060669A1 Three-Dimensional Semiconductor Image Reconstruction Apparatus and Method Public/Granted day:2015-03-05
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