Invention Grant
- Patent Title: Universal serial bus hybrid footprint design
- Patent Title (中): 通用串行总线混合脚印设计
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Application No.: US13727701Application Date: 2012-12-27
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Publication No.: US09326380B2Publication Date: 2016-04-26
- Inventor: Kuan-Yu Chen , Howard L. Heck
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/03 ; H05K3/00 ; H01R12/57 ; H05K1/02 ; H01R12/58
Abstract:
A universal serial bus hybrid footprint design is described herein. The design includes an outer row of one or more surface mount technology (SMT) contacts and an inner row of one or more printed through holes (PTH). The hybrid footprint design enables a data through put of at least 10 Gbps.
Public/Granted literature
- US20140182914A1 UNIVERSAL SERIAL BUS HYBRID FOOTPRINT DESIGN Public/Granted day:2014-07-03
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