The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and applying to the formed tracks a protective barrier layer and a layer for soldering and/or welding elements of parts to the conductive tracks. The continuous metallization layers are applied by consecutively applying an adhesive layer, a conductive layer, and a metal layer, acting as a mask, to the non-conductive substrate. To form the metallization pattern, a mask is formed by laser ablation on sections of the metal layer not occupied by conductive tracks, then selective chemical etching removes the conductive layer and adhesive sublayer from the exposed sections, and selective chemical etching removes the mask, after which the protective barrier layer and layer for soldering and/or welding are applied.