Invention Grant
- Patent Title: Honeycomb structure
- Patent Title (中): 蜂窝结构
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Application No.: US14660066Application Date: 2015-03-17
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Publication No.: US09333486B2Publication Date: 2016-05-10
- Inventor: Mitsuharu Ono , Fumiharu Sato , Shuji Ueda , Hiroyuki Suenobu
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2014-063841 20140326
- Main IPC: B01J21/00
- IPC: B01J21/00 ; B01J21/04 ; B01J23/02 ; B01D3/10 ; B01D50/00 ; B01D53/34 ; B32B3/12 ; G03B21/62 ; D06N7/04 ; B01J21/16 ; C04B35/14 ; C04B38/00 ; C04B38/06 ; B01D46/24 ; B01D53/94 ; B01J21/12 ; B01J23/30 ; B01J35/00 ; B01J35/04 ; F01N3/022 ; C04B35/626 ; C04B35/63

Abstract:
There is disclosed a honeycomb structure. A honeycomb structure includes a pillar-shaped honeycomb structure body having partition walls defining a plurality of cells which become through channels for a fluid and extend from a first end face to a second end face, the partition walls are constituted of a porous body having aggregates and a bonding material to bond the aggregates to one another in a state where pores are formed among the aggregates, the aggregates include molten silica particles, the bonding material includes glass, a content ratio of SiO2 in the porous body is 70 mass % or more, and a thermal expansion coefficient of the porous body at 40 to 800° C. is from 1.5 to 6.0×10−6/° C.
Public/Granted literature
- US20150273436A1 HONEYCOMB STRUCTURE Public/Granted day:2015-10-01
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